Looking through the blogshphere, we find packaging issues ahead of the holidays; Life on the IoT edge; billions of connected devices – what does it even mean? and taking nature’s lead in 3D printing
According to Paul McLellan, Cadence, Moore’s Law is running out of steam. He spoke to John Park about advanced packaging and heterogeneous integration.
Living life on the edge, Jeff Miller, Mentor Graphics, sets out a step program for IoT design and advocates a standardized directory structure.
Anticipating one trillion smart, connected devices, Christine Young, Maxim Integrated, looks to the future and what the predicted scale of connectivity will mean for intelligence gathering and sharing, and their role in emerging technologies, such as blockchain.
Taking a cue from nature’s own materials, Scott Goodrich, Fortify guest blogs for ANSYS to explain how magnetic fields were used in 3D printing to align fibers for high strength-to-weight ratio printed parts.
Consumer trends that signal the end of wired audio connections has set Mark Melvin, ON Semiconductor, thinking about hearing aids and adding intelligence via wireless connectivity with smartphones.
Trends for the semiconductor chip market are discussed by John Blyler and Jim Feldan, Semico Research. The complexity is increasing which could impact the number of design starts. One trend is IP reuse and this informative report looks into the facts and figures in great detail to provide an understanding of the industry direction.
By Caroline Hayes, Senior Editor
